ITI Limited - Facilities

EPS-95

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Contact Details
A.V Murdeshwar
Deputy General Manager,
ITI Limited,
Bangalore Plant and R&D,
Dooravaninagar,
Bangalore-560016, Karnataka,India.

Phone :+919845815940,
080-26567640
Email: avmurdeshwar_bgp[at]itiltd[dot]co[dot]in

MECHANICAL DEPARTMENT

This department has already produced many military as well as commercial products. This department has complete machine lines to produce a product.

Turret Machine — CNC Turret

Bending Machine — LVD PPEB SERIES

Injection molding machines — MAGNA-T SERIES

Wire electrical discharge machine — ONA AF-25

Die sinking erosion machine — ONA NX4C

3D PRINTERS

This department is creating the prototype for the upcoming product. It is currently in very much demand becuase of its precise and cost-efficient machines.

3D printer — STRATASYS FORTUS 450mc

3D printer — STRATASYS J750

PCB DEPARTMENT

Turret Machine — CNC Drilling Machine

Dry Film Developing Machine

CNC Routing Machine

Bare Board Testing

SMT DEPARTMENT

PCB Handling Equipments

Solder Paste Printer — Automatic Solder Paste Printer

Solder Paste Inspection machine — Automatic Solder Paste Inspection Machine

Pick & Place System — Automatic Pick & Place System

Optical Inspection Machine — Automatic Optical Inspection Machine

Forced Convection SMT — Forced Convection SMT Reflow oven

Semi Automatic IR based — Semi Automatic IR based SMT Rework station

Semi Automatic Hot Air — Semi Automatic Hot Air SMT Rework station

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Last Updated
20^th November 2024

LVD CNC PRESS BRAKE (135 Ton)

SPECIFICATIONS:

Capacity: 135 Tons.

Model: PPEB 135/30.

Maximum bed length: 3000mm.

No of axis: 9axis(with sheet follower/supporter & automatic crowning).

Maximum bending thickness: 3mm.

Raw materials like Mild steel, Aluminium, Stainless steel, Brass and copper can be bent.

HMI interface with SIEMENS control system.

Multiple programs can be created based on the thickness and material tooling combination using HMI touch screen interface.

Visual collision detection check & simulation of steps before actual bending.

Year of manufacture: 2016.

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STRATASYS FORTUS 450mc

SPECIFICATIONS:

Build Envelope (XYZ): 406 x 355 x 406 mm (16 x 14 x 16 in.)

Material Delivery: Two bays each for material and support canisters auto changeover between canisters.

System Size and Weight: 129.5 cm x 90.2 cm x 198.4 cm (51 x 35.5 x 78.1 in.) 601 kg (1325 lbs.).

Achievable Accuracy: Parts are produced within an accuracy of ± .127 mm (± .005 in.) or ± .0015 mm/mm (± .0015 in/in), whichever is greater). Z part accuracy includes an additional tolerance of - 0.000/+slice height. Note: Accuracy is geometry dependent. Achievable accuracy specification derived from statistical data at 95% dimensional yield.

Network Communication: 10/100 base T connection. Ethernet protocol.

Operator Attendance: Limited attendance for job start and stop required.

Power Requirements: 208VAC 3 phase, 50/60 Hz, consumes 18 Amps.

Regulatory Compliance: CE

Software: All Fortus systems include Insight™ and Control Center™ job processing and management software. Compatible with GrabCAD Print for use with job reports, scheduling and remote monitoring.

Operating System: Microsoft Windows 8.1 and Windows 8 (Pro, Enterprise), Microsoft Windows 7 (Pro, Enterprise, Ultimate), Microsoft Windows Vista (Business, Enterprise, Ultimate),Microsoft Windows Server 2008, Microsoft Windows Server 2003.

STRATASYS J750

SPECIFICATIONS:

Model Materials:

Vero™ family of opaque materials including neutral shades and vibrant VeroVivid™ colors.

VeroFlex™ and VeroFlexVivid™ families of strong but slightly flexible materials.

Tango™ and Agilus30™ families of flexible materials.

Transparent VeroClear™ and RGD720.

Digital Model Materials:

Over 500,000 colors.

Digital ABS Plus and Digital ABS2 Plus™ in ivory and green.

Rubber-like materials in a variety of Shore A values.

Translucent color tints.

User-developed digital materials with GrabCAD Voxel Print™.

Support Materials:

SUP705™ (WaterJet removable).

SUP706B™ (soluble).

Build Size: 490 x 390 x 200 mm (19.3 x 15.35 x 7.9 in.).

Layer Thickness: Horizontal build layers down to 14 microns (0.00055 in.).

User-developed digital materials with GrabCAD Voxel Print™.

Workstation Compatibility: Windows 7 and 8.1.

Network Connectivity: LAN - TCP/IP.

System Size and Weight: 1400 x 1260 x 1100 mm (55.1 x 49.6 x 43.4 in.); 430 kg (948 lbs.)

Material Cabinet: 670 x 1,170 x 640 mm (26.4 x 46.1 x 25.2 in.); 152 kg (335 lbs.)

Operating Conditions:

Temperature: 18 – 25 °C (64 – 77 °F);

relative humidity: 30-70% (non-condensing).

Power Requirements:

100–120 VAC, 50–60 Hz, 13.5 A, 1 phase

220–240 VAC, 50–60 Hz, 7 A, 1 phase

Regulatory Compliance: CE, FCC, EAC.

Software: GrabCAD Print, including the optional add-on GrabCAD Voxel Print.

Build Modes:

High Speed: up to 3 base resins, 27-micron (0.001 in.) resolution.

High Quality: up to 6 base resins, 14-micron (0.00055 in.) resolution.

High Mix: up to 6 base resins, 27-micron (0.001 in.) resolution.

Accuracy: Typical deviation from STL dimensions, for models printed with rigid materials, based on size:under 100 mm – ±100μ; above100 mm – ±200μ or ± 0.06% of part length, whichever is greater.

CNC Drilling Machine

SPECIFICATIONS:

6 Heads

6 air Bearing spindles running at 180 krpm

X.Y.Z axis on linear motors

Accelerations : X,Y Axes : 1.5g - Z Axis 3g

Granite Body

X and Y axes speed 50 mtrs/min and Z axis 35 mtrs/min

X, Y, Z, Axis on high resolution linear guides

High Resolution linear scales (0,001mm - 0.00003937) axes positioning

Contact Sensing Broken bit detection

6 Laser stations for tool height, diameter and dynamic run-out check

Dry Film Developing Machine

SPECIFICATIONS:

Temperature accuracy for all the process solutions. : ± 1º Celsius

Conveyor width : 750 mm

Effective width : 650 mm

Board thickness : 0.1 mm to 5.0 mm

Conveyor Speed 0.1 to 4 Meters / Min. with Step-less

Spray pressure Spray Pressure must be in the range of 35 to 40 PSI, adjustable

Conveyor type Horizontal with left to right direction, should support thin core laminate transportation down to 0.1mm thickness.

Outer dimension : 6659mm L x 2187mm W x 2617 ± 25mm H

Conveyor speed : 0 ~ 5 m/min (adjustable)

Roller diameter : 40 mm

Roller distance : 35 mm

Spray system achieve uniform & Complete Dry Film Developing of the circuit with 2-mil lines / 2- mil spacing. Adjustable in Main developing and Post developing modules.

CNC Routing Machine

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Bare Board Testing

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PCB Handling Equipments for SMT line

SPECIFICATIONS:

PCB Loader and Unloader:

LED tower light with buzzer

Dual clamping for Magazine warp prevention

Vertical alignment of Magazine conveyor

Emergency switch

SMEMA Cable

Double plate structure

Magazine rack 50 slots and for PCB size 510 mm X 510 mm (U Size)

Magazine exchange time : 28 sec

Bottom to Top magazine flow

CE certified

Inspection conveyor, mode l: ACC-100 CE U (YJ Link)

PCB size 510 mm × 510 mm (U size)

1000 mm working length

Double plate structure

CE certified

Pass/work mode inspection function

Conveyor speed controller option

Touch screen

Automatic Solder Paste Printer for SMT line with Accessories

SPECIFICATIONS:

Economical in-line system with closed loop print head & Stencil underside cleaning

EKRA Vision Alignment system

Quick Exchange Squeegee system

Dynamic Scalability

Simplex User Interface & Touch Screen function

Suitable for stencils up to 31"

Customized for individual needs

Print format up to 610 mm X 510 mm

Program changeover time less than 2 minutes

EMS Manufacturing for high volume/ high mix applications

Automatic Solder Paste Inspection machine for SMT line with Accessories

SPECIFICATIONS:

The KY-8030 is an in-line fully automated SPI system

Shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste

Inspects solder paste Volume, Area, Height, Offset, Bridging, Shape Deformity

Highest accuracy and repeatability

Shortest programming time

Easy UI & SPC Plus included to help printing process optimization

Accurate, powerful SPC tool package

Guarantees correct solder joint volume per IPC 610 requirements

No PCB color sensitivity

Solder paste printing optimization-at its best

Automatic Pick & Place System for SMT line with Accessories

SPECIFICATIONS:

Latest Generation, Advanced pick and place machine (NXT III), Multi component Mounter (XPF-W), rated capacity of 104,000 CPH, and completely configurable as per production requirement with different placement heads in NXTIII, with a feeder capacity of over 285 nos of 8 mm slots & tray unit to handle any complex type board. Machine has the capacity to place the smallest component available (03015) up to BGA, Micro BGA, CSP etc.

Model NXT III

High speed Multi function modular placing Machine

Improved productivity achieves Rated Capacity of 63,500 cph (Chips per hour)

0201 mm part support

Improved usability

Improved compatibility

Supports Glue application process

Supports for panel up to 610 mm × 534 mm

Model XPF-W, Fuji

High Speed multipurpose mounter

Rated Capacity of 49,600 CPH (0.145 sec/ component)

Placing heads are exchanged automatically during production

High Speed and multipurpose needs at the same time

Support for panels up to 686 mm X 508 mm

Automatic Optical Inspection Machine for SMT line with Accessories

SPECIFICATIONS:

Inline 5 Mega Pixel Automated Optical System with 12 micron High Magnification

Quick set-up

High speed

PCB Handling size 22" X 20"

High defect Coverage

Low false failure rate

Automated inspection for Solder defects, lead defects, component presence and position, correct part number and polarity, through hole parts and paste

Minimum component size 0201 to 01005 with high magnification option

Color, OCV, OCR, bar code recognition, both image and rule based algorithms

Forced Convection SMT Reflow oven with Accessories

SPECIFICATIONS:

12 heating zones and 4 cooling zones

Autoset Profile /receipe generator

350º C maximum setpoint temperature

Flux Flow Control flux evacuation system

Patented Individual Cell Inlet and Exhaust enables optimized gas flow management

Active forced convection and bottom cooling cells

Easy to maintain cooling zones

Semi Automatic IR based SMT Rework station with Accessories

SPECIFICATIONS:

Semi Automatic IR based SMT Rework station with Accessories

Quartz IR PCB preheater large area (520 mm X 320 mm) 3000W system

Advanced Precision component pick and placement

Component nest / flux application facility

Precision X/Y/Theta PCB Table

Auto -profile process control package

BGA Alignment

Optional Auxiliary Process Camera

Real time measurement of component temperatures

Precision PCB Temperature sensing

Semi Automatic Hot Air SMT Rework station with Accessories

SPECIFICATIONS:

Flexible- Patented Hybrid Technology. Various successfully tested tools of small QFNs to larger processor sockets.

Uses Auto Vision Technology

Equipment for residual solder removal and dispensing functions

High resolution CMOS 5 Mega Pixel camera

Hybrid underheater with IR and Convection

Board warping is avoided

Precision hot air technology

Guarantees best soldering results

Placement nozzle with automatic 4- Axes Control

Efficient and faster